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item:memory:zh [2022/08/11 11:27] fight_xing created |
item:memory:zh [2023/11/28 07:55] (current) hfsr [内存条] |
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| - | Memory | + | 内存条 |
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| - | **本篇文章的部分/全部内容还没有进行翻译。** | ||
| {{:items:ram1.png?nolink&128|}} {{:items:ram1.5.png?nolink&128|}}\\ | {{:items:ram1.png?nolink&128|}} {{:items:ram1.5.png?nolink&128|}}\\ | ||
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| {{:items:ram3.png?nolink&128|}} {{:items:ram3.5.png?nolink&128|}} | {{:items:ram3.png?nolink&128|}} {{:items:ram3.5.png?nolink&128|}} | ||
| - | Memory (RAM) comes in six tiers, with increasing sizes (each tier's size is configurable). They fall into the three item tiers like so: {1, 1.5}, {2, 2.5}, {3, 3.5}. Memory isn't really a component, since it does not provide any Lua callbacks, but it can be installed into [[block:case|computer cases]] to increase the available RAM of the computer, which allows running more complex programs. | + | 内存条 (RAM) 分为6个等级，其容量大小逐级递增（各等级大小均可配置）。它们与其他部件的三个等级的对应关系为：{1, 1.5}, {2, 2.5}, {3, 3.5}。内存条并不是真正的组件，因为它不提供任何Lua回调，但是它可以安装到[[block:computer_case:zh|机箱]]中以增加电脑的可用RAM大小，从而允许其运行更加复杂的程序。 |
| - | The Memory (Tier 1) is crafted using the following recipe: | + | 1级内存条由以下配方合成： |
| - | * 1 x Iron nugget/oreberry (with Tinker's Construct) | + | |
| - | * 2 x [[item:materials|Microchip (Tier 1)]] | + | * 1 x 铁粒或矿莓（若安装匠魂模组） |
| - | * 1 x [[item:materials|Printed Circuit Board]] | + | * 2 x [[item:materials:zh#微芯片|1级微芯片]] |
| + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | ||
| {{:recipes:items:t1ram.png?nolink&200|}} | {{:recipes:items:t1ram.png?nolink&200|}} | ||
| - | The Memory (Tier 1.5) is crafted using the following recipe: | + | 1.5级内存条由以下配方合成： |
| - | * 1 x [[item:materials|Microchip (Tier 2)]] | + | |
| - | * 2 x [[item:materials|Microchip (Tier 1)]] | + | * 1 x [[item:materials:zh#微芯片|2级微芯片]] |
| - | * 1 x [[item:materials|Printed Circuit Board]] | + | * 2 x [[item:materials:zh#微芯片|1级微芯片]] |
| + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | ||
| {{:recipes:items:t1.5ram.png?nolink&200|}} | {{:recipes:items:t1.5ram.png?nolink&200|}} | ||
| - | The Memory (Tier 2) is crafted using the following recipe: | + | 2级内存条由以下配方合成： |
| - | * 1 x Iron nugget/oreberry (with Tinker's Construct) | + | |
| - | * 2 x [[item:materials|Microchip (Tier 2)]] | + | * 1 x 铁粒或矿莓（若安装匠魂模组） |
| - | * 1 x [[item:materials|Printed Circuit Board]] | + | * 2 x [[item:materials:zh#微芯片|2级微芯片]] |
| + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | ||
| {{:recipes:items:t2ram.png?nolink&200|}} | {{:recipes:items:t2ram.png?nolink&200|}} | ||
| - | The Memory (Tier 2.5) is crafted using the following recipe: | + | 2.5级内存条由以下配方合成： |
| - | * 1 x [[item:materials|Microchip (Tier 3)]] | + | |
| - | * 2 x [[item:materials|Microchip (Tier 2)]] | + | * 1 x [[item:materials:zh#微芯片|3级微芯片]] |
| - | * 1 x [[item:materials|Printed Circuit Board]] | + | * 2 x [[item:materials:zh#微芯片|2级微芯片]] |
| + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | ||
| {{:recipes:items:t2.5ram.png?nolink&200|}} | {{:recipes:items:t2.5ram.png?nolink&200|}} | ||
| - | The Memory (Tier 3) is crafted using the following recipe: | + | 3级内存条由以下配方合成： |
| - | * 1 x Iron nugget/oreberry (with Tinker's Construct) | + | |
| - | * 2 x [[item:materials|Microchip (Tier 3)]] | + | * 1 x 铁粒或矿莓（若安装匠魂模组） |
| - | * 1 x [[item:materials|Printed Circuit Board]] | + | * 2 x [[item:materials:zh#微芯片|3级微芯片]] |
| + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | ||
| {{:recipes:items:t3ram.png?nolink&200|}} | {{:recipes:items:t3ram.png?nolink&200|}} | ||
| - | The Memory (Tier 3.5) is crafted using the following recipe: | + | 3.5级内存条由以下配方合成： |
| - | * 3 x [[item:materials|Microchip (Tier 3)]] | + | |
| - | * 2 x [[item:materials|Microchip (Tier 2)]] | + | * 3 x [[item:materials:zh#微芯片|3级微芯片]] |
| - | * 1 x [[item:materials|Printed Circuit Board]] | + | * 2 x [[item:materials:zh#微芯片|2级微芯片]] |
| + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板] | ||
| {{:recipes:items:t3.5ram.png?nolink&200|}} | {{:recipes:items:t3.5ram.png?nolink&200|}} | ||