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item:materials:zh [2023/10/24 09:26] hfsr |
item:materials:zh [2023/11/28 06:41] hfsr [中间配件] |
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| ===未加工电路板== | ===未加工电路板== | ||
| - | 未加工电路板（8x）的配方为： | + | 未加工电路板的配方（产出8x）为： |
| * 1 x 黏土块 | * 1 x 黏土块 | ||
| * 1 x 金锭 | * 1 x 金锭 | ||
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| ===晶体管=== | ===晶体管=== | ||
| - | 晶体管（8x）的配方为： | + | 晶体管的配方（产出8x）为： |
| * 3 x 铁锭 | * 3 x 铁锭 | ||
| * 2 x 金粒/矿莓 | * 2 x 金粒/矿莓 | ||
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| ===钻石片== | ===钻石片== | ||
| - | 钻石片（6x）的配方为： | + | 钻石片的配方（产出6x）为： |
| * 1 x [[item:materials#切割线|切割线]] | * 1 x [[item:materials#切割线|切割线]] | ||
| * 1 x 钻石 | * 1 x 钻石 | ||
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| ===微芯片=== | ===微芯片=== | ||
| - | 一级微芯片（8x）的配方为： | + | 1级微芯片的配方（产出8x）为： |
| * 1 x [[item:materials:zh#晶体管|晶体管]] | * 1 x [[item:materials:zh#晶体管|晶体管]] | ||
| * 2 x 红石粉 | * 2 x 红石粉 | ||
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| {{:recipes:items:t1microchip.png?nolink&200|}} | {{:recipes:items:t1microchip.png?nolink&200|}} | ||
| - | 二级微芯片（4x）的配方为： | + | 2级微芯片的配方（产出4x）为： |
| * 1 x [[item:materials:zh#晶体管|晶体管]] | * 1 x [[item:materials:zh#晶体管|晶体管]] | ||
| * 2 x 红石粉 | * 2 x 红石粉 | ||
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| {{:recipes:items:t2microchip.png?nolink&200|}} | {{:recipes:items:t2microchip.png?nolink&200|}} | ||
| - | 三级微芯片（2x）的配方为： | + | 3级微芯片的配方（产出2x）为： |
| * 1 x [[item:materials:zh#晶体管|晶体管]] | * 1 x [[item:materials:zh#晶体管|晶体管]] | ||
| * 2 x 红石粉 | * 2 x 红石粉 | ||
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| {{:recipes:items:tier3microchip.png?nolink&200|}} | {{:recipes:items:tier3microchip.png?nolink&200|}} | ||
| - | ===基板=== | + | ===扩展卡基板=== |
| - | 基板是用于制造各种扩展卡的关键配件，例如[[item:graphics_card:zh|显卡]]，[[item:network_card:zh|网卡]]，[[item:linked_card:zh|Linked Cards]]，等等。 | + | 扩展卡基板是用于制造各种扩展卡的关键配件，例如[[item:graphics_card:zh|显卡]]、[[item:network_card:zh|网卡]]和[[item:linked_card:zh|连接卡]]等等。 |
| - | 基板的配方为： | + | 扩展卡基板的配方为： |
| * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] | ||
| * 3 x 铁粒/矿莓 | * 3 x 铁粒/矿莓 | ||
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| {{:recipes:items:cardbase.png?nolink&200|}} | {{:recipes:items:cardbase.png?nolink&200|}} | ||
| - | ===控制单元（CU）=== | + | ===控制单元=== |
| 控制单元的配方为： | 控制单元的配方为： | ||