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item:component_bus:zh [2022/08/12 02:43] fight_xing [Component Bus] |
item:component_bus:zh [2023/11/28 08:51] (current) hfsr [组件总线] |
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- | Component Bus | + | 组件总线 |
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- | **本页面的部分/全部内容还没有翻译完毕。** | ||
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{{:items:componentbus0.png?nolink&128}}{{:items:componentbus1.png?nolink&128}}{{:items:componentbus2.png?nolink&128}} | {{:items:componentbus0.png?nolink&128}}{{:items:componentbus1.png?nolink&128}}{{:items:componentbus2.png?nolink&128}} | ||
- | A component bus has similar functionality as a CPU, it controls the number of components that can be connected to a computer before it will not start anymore / crash. It does not replace a CPU however. At the time of writing, component buses can only be built into servers, allowing them to support a much larger number of concurrent components than normal computers. | + | 组件总线的功能类似CPU的部分功能,它决定了在电脑不会无法启动/崩溃的前提下所能连接的组件数量,但是它不能代替CPU。截止到此内容编写时,组件总线只能被安装到服务器中,让服务器能比普通电脑支持同时存在更多组件。 |
- | The Component Bus (Tier 1) is crafted using the following recipe: | + | 1级组件总线由以下配方合成: |
- | * 4 x Iron nugget/oreberry | + | * 4 x 铁粒/矿莓 |
- | * 1 x Redstone dust | + | * 1 x 红石粉 |
- | * 1 x [[item:materials|Microchip (Tier 1)]] | + | * 1 x [[item:materials:zh#微芯片|1级微芯片]] |
- | * 1 x [[item:materials|Control Unit]] | + | * 1 x [[item:materials:zh#控制单元|控制单元]] |
- | * 1 x [[item:materials|Printed Circuit Board]] | + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] |
{{:recipes:items:t1compbus.png?nolink&200}} | {{:recipes:items:t1compbus.png?nolink&200}} | ||
- | The Component Bus (Tier 2) is crafted using the following recipe: | + | 2级组件总线由以下配方合成: |
- | * 4 x Gold nugget/oreberry | + | * 4 x 金粒/矿莓 |
- | * 1 x Redstone dust | + | * 1 x 红石粉 |
- | * 1 x [[item:materials|Microchip (Tier 2)]] | + | * 1 x [[item:materials:zh#微芯片|2级微芯片]] |
- | * 1 x [[item:materials|Control Unit]] | + | * 1 x [[item:materials:zh#控制单元|控制单元]] |
- | * 1 x [[item:materials|Printed Circuit Board]] | + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] |
{{:recipes:items:t2compbus.png?nolink&200}} | {{:recipes:items:t2compbus.png?nolink&200}} | ||
- | The Component Bus (Tier 3) is crafted using the following recipe: | + | 3级组件总线由以下配方合成: |
- | * 4 x Emerald | + | * 4 x 绿宝石 |
- | * 1 x Redstone dust | + | * 1 x 红石粉 |
- | * 1 x [[item:materials|Microchip (Tier 3)]] | + | * 1 x [[item:materials:zh#微芯片|3级微芯片]] |
- | * 1 x [[item:materials|Control Unit]] | + | * 1 x [[item:materials:zh#控制单元|控制单元]] |
- | * 1 x [[item:materials|Printed Circuit Board]] | + | * 1 x [[item:materials:zh#印刷电路板|印刷电路板]] |
{{:recipes:items:t3compbus.png?nolink&200}} | {{:recipes:items:t3compbus.png?nolink&200}} | ||