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item:component_bus:zh [2022/08/12 02:43]
fight_xing [Component Bus]
item:component_bus:zh [2023/11/28 08:51] (current)
hfsr [组件总线]
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-Component Bus+组件总线
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-**本页面的部分/​全部内容还没有翻译完毕。** 
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 {{:​items:​componentbus0.png?​nolink&​128}}{{:​items:​componentbus1.png?​nolink&​128}}{{:​items:​componentbus2.png?​nolink&​128}} {{:​items:​componentbus0.png?​nolink&​128}}{{:​items:​componentbus1.png?​nolink&​128}}{{:​items:​componentbus2.png?​nolink&​128}}
  
-A component bus has similar functionality as a CPU, it controls the number of components that can be connected to a computer before it will not start anymore ​crash. It does not replace a CPU however. At the time of writing, component buses can only be built into servers, allowing them to support a much larger number of concurrent components than normal computers.+组件总线的功能类似CPU的部分功能,它决定了在电脑不会无法启动/崩溃的前提下所能连接的组件数量,但是它不能代替CPU。截止到此内容编写时,组件总线只能被安装到服务器中,让服务器能比普通电脑支持同时存在更多组件。
  
-The Component Bus (Tier 1) is crafted using the following recipe: +1级组件总线由以下配方合成: 
-  * 4 x Iron nugget/oreberry +  * 4 x 铁粒/矿莓 
-  * 1 x Redstone dust +  * 1 x 红石粉 
-  * 1 x [[item:​materials|Microchip (Tier 1)]] +  * 1 x [[item:​materials:​zh#​微芯片|1级微芯片]] 
-  * 1 x [[item:​materials|Control Unit]] +  * 1 x [[item:​materials:​zh#​控制单元|控制单元]] 
-  * 1 x [[item:​materials|Printed Circuit Board]]+  * 1 x [[item:​materials:​zh#​印刷电路板|印刷电路板]]
 {{:​recipes:​items:​t1compbus.png?​nolink&​200}} {{:​recipes:​items:​t1compbus.png?​nolink&​200}}
  
-The Component Bus (Tier 2) is crafted using the following recipe: +2级组件总线由以下配方合成: 
-  * 4 x Gold nugget/oreberry +  * 4 x 金粒/矿莓 
-  * 1 x Redstone dust +  * 1 x 红石粉 
-  * 1 x [[item:​materials|Microchip (Tier 2)]] +  * 1 x [[item:​materials:​zh#​微芯片|2级微芯片]] 
-  * 1 x [[item:​materials|Control Unit]] +  * 1 x [[item:​materials:​zh#​控制单元|控制单元]] 
-  * 1 x [[item:​materials|Printed Circuit Board]]+  * 1 x [[item:​materials:​zh#​印刷电路板|印刷电路板]]
 {{:​recipes:​items:​t2compbus.png?​nolink&​200}} {{:​recipes:​items:​t2compbus.png?​nolink&​200}}
  
-The Component Bus (Tier 3) is crafted using the following recipe: +3级组件总线由以下配方合成: 
-  * 4 x Emerald +  * 4 x 绿宝石 
-  * 1 x Redstone dust +  * 1 x 红石粉 
-  * 1 x [[item:​materials|Microchip (Tier 3)]] +  * 1 x [[item:​materials:​zh#​微芯片|3级微芯片]] 
-  * 1 x [[item:​materials|Control Unit]] +  * 1 x [[item:​materials:​zh#​控制单元|控制单元]] 
-  * 1 x [[item:​materials|Printed Circuit Board]]+  * 1 x [[item:​materials:​zh#​印刷电路板|印刷电路板]]
 {{:​recipes:​items:​t3compbus.png?​nolink&​200}} {{:​recipes:​items:​t3compbus.png?​nolink&​200}}